Printed Circuit Board Manufacturing Process

PCB board process can be roughly divided into the following twelve steps, each process requires a variety of process processing production, it should be noted that the different structures of the board its process is not the same, the following process for the complete production of multi-layer PCB process;

First, the inner layer; mainly for the production of PCB circuit boards in the inner layer of the line; production process for:

1, cut the board: PCB substrate cut to production size;

2, pre-treatment: clean the surface of the PCB substrate, remove surface contaminants

3, pressure film: the dry film on the surface of the PCB substrate, for the subsequent image transfer to prepare;

4, exposure: the use of exposure equipment using ultraviolet light on the substrate attached to the film exposure, so that the image of the substrate will be transferred to the dry film.

5, DE: will be exposed after the substrate through the development, etching, film, and then complete the production of the inner layer of the board

Second, the internal inspection; mainly for the detection and repair of the board line.

1, AOI: AOI optical scanning, can be the image of the PCB board and has been entered into the good board data to do comparison, in order to find the board image above the gap, depression and other defective phenomena;.

2, VRS: After the AOI detected defective image data transmitted to the VRS, by the relevant personnel for overhaul.

3, fill line: the gold wire welded to the gap or depression to prevent electrical malpractice.

Third, press-fit; as the name suggests is to press multiple inner laminates into a single board;.

1, browning: browning can increase the adhesion between the board and the resin, as well as increase the wettability of the copper surface;

2, riveting:, the PP cut into small sheets and normal size so that the inner layer of the board and the corresponding PP MouJin

3, laminated compression, targeting, gong edge, grinding edge.

Fourth, drilling; in accordance with customer requirements using a drilling machine will be drilled out of the board with different diameters, different sizes of holes, so that the board through the holes in order to follow up on the processing of plug-ins, but also to help the board heat dissipation.

Five, a copper; for the outer board has been drilled holes in copper plating, so that the board of all layers of the line conduction.

1, deburring line: to remove the board hole edge burrs, to prevent copper-plated bad;

2, in addition to the glue line: remove the hole inside the glue residue; in order to increase the adhesion in the micro-etching.

3, a copper (pth): copper-plated holes in the board to make the various layers of the line conduction, while increasing the copper thickness.

Six, the outer layer; the outer layer with the first step of the inner layer of the process is roughly the same, its purpose is to facilitate the subsequent process to make the line;

1, pre-treatment: through pickling, grinding and brushing and drying to clean the surface of the board in order to increase the adhesion of dry film; 2, pressure film: the dry film will be used to increase the adhesion of the board.

2, pressure film: the dry film on the surface of the PCB substrate, for the subsequent image transfer to prepare;

3, exposure: UV light irradiation, so that the dry film on the board to form a polymerized and unpolymerized state; 4, development: will be in the exposure of the PCB substrate surface, in preparation for the subsequent image transfer.

4, development: will not be polymerized in the exposure process of the dry film dissolved, leaving the pitch;

Seven, the second copper and etching; the second copper plating, etching;

1, the second copper: electroplating graphics, for the hole is not covered with dry film in the place of ferry chemical copper; while further increasing the conductivity and copper thickness, and then after tin plating to protect the integrity of the line, the holes when etching;

2, SES: by removing the film, etching, tin stripping and other processes to deal with the outer dry film (wet film) attached to the area of the bottom copper etching, the outer line to the completion of the production here;

Eight, soldermask: can protect the board to prevent oxidization and other phenomena;

1, pre-treatment: acid washing, ultrasonic washing and other processes to remove the board oxides, increase the roughness of the copper surface;

2, printing: PCB boards do not need to weld the place covered with soldermask ink, play a protective, insulating role;

3、Pre-baking: dry the solvent inside the solder resist ink, and at the same time make the ink harden in order to exposure; 4、Exposure: through the UV light, the solder resist ink will be exposed to the light.

4, exposure: through UV light irradiation curing solder resist ink, through photosensitive polymerization to form polymer; 5, development: to remove the unpolymerized solder resist ink.

5, Developing: Remove the sodium carbonate solution in the unpolymerized ink; and

6, after baking: so that the ink is completely hardened;

Nine, text; printing text.

1, pickling: clean the surface of the board, remove surface oxidation to strengthen the adhesion of printing ink;

2、Text: Print text to facilitate subsequent welding process;.

Ten, surface treatment OSP; the side of the bare copper plate to be welded by the coating treatment, the formation of a layer of organic skin film to prevent rust oxidation.

Eleven, molding; gong out of the customer's needs of the board shape, convenient for customers to SMT patch and assembly.

Twelve, flying pin test; test the board circuit, to avoid short circuit board outflow.

Thirteen, FQC; final inspection, after the completion of all the processes for sampling full inspection;

Fourteen, packaging, warehousing; will do a good job of the PCB board vacuum-packed, packaged for shipment to complete the delivery;