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NO. | Items | Description |
1 | Layers | 1-30 layers |
2 | Max panel size | 750x620 29.5"x 24.2” |
3 | Board thickness | 2layers:0.20-3.0mm 4layers:0.40-4.0mm 6layers:0.80--5.0mm |
4 | Min trace width | 3mil/0.075mm |
5 | Min trace spacing | 3mil/0.075mm |
6 | Min hole size | 8mil /0.2mm |
7 | Min Annual Ring | 0.10mm/4mil |
8 | Min hole copper weight | average 0.02mm(Single-unit0.018mm) |
9 | Tolerance of NPTH | ± 0.05mm |
10 | Tolerance of PTH | ± 0.075mm |
11 | Copper thickness | HOZ-200Z |
12 | Tolerance of outline | ±0.10mm |
13 | Bow and twist | ≤0.75% |
14 | Tolerance of hole alignment | ±0.05mm |
15 | Solder mask Registration | +/-30um |
16 | Dielectric strength | >50kv/mm |
17 | Solder mask Abrasion | >6H |
18 | Heat shock | 288℃、10seconds、 thrice |
19 | Anti-Fire rate | 94V-0 |
20 | Test voltage | 500-5000V |
Special Products
NO. | Items | Batch production capacity | Small batch orUltimate capacity |
1 | Layers | 1-30 layers | 1-40 layers |
2 | Max panel size | 750x620 29.5"x24.2" | 750x620 29.5"x24.2" |
3 | Base Material | FR-4、 CEM-3、Aluminum, high-freguency material | FR-4、CEM-3、Aluminum、 copper、high-freguencymaterial、 Ceramic、PTFE, Metal sandwich |
4 | Finished copper thickness | HO2-20 OZ | HO2-28 OZ |
5 | Voltage endurance capability | 500-3000V | 500-5000V |
6 | Surface Treatment | HASL、OSP、ENIG、ImAg、lmSn、Gold Plated | HASL、OSP、ENIG、ImAg.InS nGold Plated |